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| MA4L Series Silicon PIN Limiter Diodes Features * * * * * * Low Insertion Loss and Noise Figure High Peak and Average Operating Power Various P1dB Compression Powers Low Flat Leakage Power Proven Reliable, Silicon Nitride Passivation RoHS Compliant V13 Chip Outline A Square Description M/A-COM Technology Solutions produces a series of silicon PIN limiter diodes with small and medium I-region lengths which are specifically designed for high signal applications. The devices are designed to provide low insertion loss, at zero bias, as well as low flat leakage power with fast signal response/recovery times. Parts are available as discrete die or assembled into a variety of surface mount or ceramic pill packages. See the Available Case Style table on page 6 for the specific ceramic package styles and their availability for individual part numbers. Anode B Applications The MA4Lseries of PIN limiter diodes are designed for use in passive limiter control circuits to protect sensitive receiver components such as low noise amplifiers (LNA), detectors, and mixers covering the 10 MHz to 18 GHz frequency range. Full Area Cathode Absolute Maximum Ratings1 TAMB = 25C (Unless otherwise specified) Parameter Forward Current Operating Temperature Storage Temperature Junction Temperature Mounting Temperature Absolute Maximum 100mA -55C to +125C -55C to +150C +175C +320C for 10 sec. ODS 134 Dimension A B mils 15 2 7 1* m 381 51 178 25.4 Note: The MADL-000301-01340W and MA4L401-134 "B" dimension, is 10 1 mils RF Peak & C.W. Incident Power Per Performance Table Note: 1. Exceeding any of the above ratings may cause permanent damage. 1 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 * Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, * India Tel: +91.80.43537383 * China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4L Series Silicon PIN Limiter Diodes Un-Packaged Die Electrical Specifications at TAMB = 25C Nominal Characteristics Part Number Carrier Minimum Maximum Minimum Maximum Maximum I-Region Contact Thermal Lifetime Thickness Diameter Resistance Reverse Reverse Cj0V Cj0V RS 10mA IFOR =10mA Voltage Voltage IREV = -6mA M mils C/W1 nS1 Ohms1 pF pF VR VR 15 20 20 30 30 50 100 200 250 35 35 35 50 50 75 0.08 0.10 0.09 0.14 0.13 0.07 0.18 0.20 0.19 0.21 0.20 0.15 0.15 0.20 0.30 2.10 2.10 2.00 2.00 2.50 2.50 2.00 1.50 1.20 10 10 10 20 15 70 90 200 800 2 2 2 3 3 4 13 20 25 1.2 1.2 1.2 1.4 1.5 1.5 3.5 3.0 4.5 175 175 175 150 150 150 30 30 25 V13 MA4L011-134 MA4L021-134 MA4L022-134 MA4L031-134 MA4L032-134 MA4L062-134 MA4L101-134 MADL-000301-01340W MA4L401-134 Note: 1. Test performed with the chip mounted in an ODS-30 package. * Nominal High Signal Performance at TAMB = 25C Incident Peak Power for 10dB Limiting @ 9.4GHz dBm 30 31 31 33 34 38 45 46 52 Incident Peak Power for Recovery Time 15dB Limiting (3 dB) Maximum Incident @ @ Maximum CW 9.4GHz 50W Peak Power Peak Power Input Power dBm 40 41 41 43 44 50 53 59 60 nS 10 15 15 25 25 75 100 50 250 Watts 80 90 90 125 125 200 250 500 1000 Watts 2 3 3 4 4 5 6 7 10 Part Number Incident Peak Power for 1dB Limiting @ 9.4GHz dBm MA4L011-134 MA4L021-134 MA4L022-134 MA4L031-134 MA4L032-134 MA4L062-134 MA4L101-134 MADL-000301-01340W MA4L401-134 2 7 8 8 10 11 15 20 23 30 *See page 3 for high signal performance parameter notes. ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 * Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, * India Tel: +91.80.43537383 * China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4L Series Silicon PIN Limiter Diodes Typical High Signal Peak Power Performance for the Single Shunt Limiter Diode in a 50 Test Fixture Typical Peak Power Performance for Single Shunt Limiter Diode in 50 Ohm System at 9.4 GHz, 1uS Pulse Width, 0.001 Duty 45 V13 40 35 MA4L011-134, MA4L021-134, MA4L022-134 MA4L031-134, MA4L032-134 MA4L101-134 30 MA4L401-132 MA4L301-134 Pout ( dBm ) 25 20 15 10 0 dB Loss Line 10 dB Loss Line 20 dB Loss Line 30 dB Loss Line 5 0 0 10 20 Pin ( dBm ) 30 40 50 High Signal Performance: Measured using a single shunt diode (die) attached directly to the gold plated RF housing ground with 2 mil thick conductive silver epoxy in a 50, SMA, connectorized test fixture. Chip anode contact is thermo-compression wire bonded using a 1 mil. dia. gold wire onto a 7.2 mil thick Rogers 5880 Duroid microstrip trace. A shunt coil provides the D.C. return. Test frequency = 9.4 GHz, For peak power measurements RF pulse width = 1.0 S, 0.001% duty cycle. 3 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 * Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, * India Tel: +91.80.43537383 * China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4L Series Silicon PIN Limiter Diodes Application Circuits Typical +60dBm Peak Power, 1S P.W., 0.001% Duty Cycle, +20dBm Flat Leakage Limiter Circuit V13 Transmission Line: 90 @ Fo Transmission Line: 90 @ Fo RF Input RF Output MA4L401-134 Coil: D.C. Return MA4L101-134 MA4L032-134 Typical +50dBm Peak Power, 1S P.W., 0.001% Duty Cycle, +20dBm Flat Leakage Limiter Circuit Transmission Line: 90 @ Fo RF Input RF Output MA4L032-134 Coil: D.C. Return MA4L022-134 4 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 * Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, * India Tel: +91.80.43537383 * China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4L Series Silicon PIN Limiter Diodes Notes for Specification and Nominal High Signal Performance Tables: 1) Maximum Series Resistance: RS, is measured at 500 MHz in the ODS-30 package and is equivalent to the total diode resistance: RS = Rj (Junction Resistance) + RO (Ohmic Resistance) 2) Nominal C.W. Thermal Resistance: TH is measured in a ceramic pill package, ODS-30, mounted to a metal (infinite) heatsink. Chip only thermal resistance values are approximately 2C/W lower than the ODS-30 listed package values in the specifications table. 3) Maximum High Signal Performance: Measured using a single shunt diode (die) attached directly to the gold plated RF housing ground with 2 mil thick conductive silver epoxy in a 50, SMA, connectorized test fixture. Chip anode contact is thermo-compression wire bonded using a 1 mil. diameter gold wire onto a 7.2 mil thick Rogers 5880 Duroid microstrip trace. A shunt coil provides the D.C. return. Test frequency = 9.4 GHz, RF pulse width = 1.0 S, Duty Cycle = 0.001%. 4) Maximum C.W. Incident Power: Measured in a 50, SMA, connectorized housing @ 4GHz utilizing a TWT amplifier and the same single diode assembly configuration as stated in Note 3 above. V13 Die Handling and Mounting Information Handling: All semiconductor chips should be handled with care in order to avoid damage or contamination from perspiration, salts, and skin oils. For individual die, the use of plastic tipped tweezers or vacuum pick up tools is strongly recommended. Bulk handling should ensure that abrasion and mechanical shock are minimized. Die Attach: The die have Ti-Pt-Au back and anode metal, with a final gold thickness of 1.0M. Die can be mounted with a gold-tin, eutectic solder perform or conductive silver epoxy. The metal RF and D.C. ground plane mounting surface must be free of contamination and should have a surface flatness or < 0.002". * Eutectic Die Attachment Using Hot Gas Die Bonder: An 80/20, gold / tin eutectic solder perform is recommended with a work surface temperature of 255C and a tool tip temperature of 220C. When the hot gas is applied, the temperature at the tool tip should be approximately 290C. The chip should not be exposed to a temperatures in excess of 320C for more than 10 seconds. * Eutectic Die Attachment Using Reflow Oven: Refer to Application Note M538, "Surface Mounting Instructions". * Epoxy Die Attachment: A thin, controlled amount of electrically conductive silver epoxy should be applied, approximately 1-2 mils thick to minimize ohmic and thermal resistances. A small epoxy fillet should be visible around the outer perimeter of the chip after placement to ensure full area coverage. Cure the conductive silver epoxy per the manufacturer's schedule, typically 150C for 1 hour. Wire Bonding: The chip's anode metallization stack is comprised of Ti/Pt/Au with a final gold thickness of 1.0M. Thermo-compression wedge bonding using a .7 to 1 mil diameter gold wire is recommended, depending on the contact diameter. The heat stage temperature should be set to approximately 200C with a bonding tip temperature of 125C and a force of 18 to 40 grams. Use of ultrasonic energy is not advised but if necessary it should be adjusted to the minimum required to achieve a good bond. Excessive energy or force applied to the top contact will cause the metallization to dislodge and lift off. Automatic ball bonding may also be used. See Application Note M541, "Bonding and Handling Procedures for Chip Diode Devices" for more detailed handling and assembly information. 5 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 * Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, * India Tel: +91.80.43537383 * China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4L Series Silicon PIN Limiter Diodes Part Numbering and Ordering Information When ordering the die only, use the base part number followed by a dash and the number 134. For example: The chip version of base part number MA4L021 is MA4L021-134. When ordering packaged parts, use the base part number followed by a dash plus the associated suffix as defined in Table I "Available Case Styles" below, except where the complete part number with dash number is given. For example: The MA4L011-134 die in the 186 style package becomes MA4L011-186. The capacitance values in the specification table on page 2 lists the junction capacitance for the chip. The capacitance for the same chip in an alternative package will be different and is computed by adding the junction capacitance of the chip plus the parasitic capacitance of the alternative package as defined in Table II "Associated Package Parasitics" below. V13 Table I Available Case Styles Base Part MA4L011 MA4L021 MA4L022 MA4L031 MA4L032 MA4L062 MADL-000062-105600 MA4L101 MA4L301 MADL-000301-01340W MA4L401 Chip Available Package Styles 30, 31, 32, 54, 134, 137,186, 1056, 1088 31, 120, 134, 1056 30, 32, 120, 134, 137, 186, 1056 31, 36, 134, 186, 1056 31, 32, 134, 186, 1056 134 1056 (uses MA4L062 chip) 30, 134, 186 31,1249, 1056 134 (chip used in MA4L301 series) 30, 31, 120,134, 1056 30 120 31,32 134 137 186 1088 1056 1249 Package dimensions can be found on the M/A-COM Technology Solutions website under Outline Drawings Table II Associated Package Parasitics Package Style 30 31 32 120 134 137 186 1056 1088 1249 Nominal Package Description Ceramic Pill Ceramic Pill Ceramic Pill Ceramic Pill Chip Epoxy Encapsulated Ceramic Surface Mount with Leads Ceramic Surface Mount with Leads Ceramic Surface Mount with Wrap Around Contacts Epoxy Encapsulated Ceramic Surface Mount with Leads Epoxy Encapsulated Ceramic Surface Mount with Wrap Around Contacts CPKG pF 0.18 0.18 0.30 0.13 N/A 0.14 0.15 0.20 0.12 0.12 LS nH 0.60 0.60 0.40 0.40 N/A 0.70 0.70 0.70 0.70 0.70 6 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 * Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, * India Tel: +91.80.43537383 * China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. |
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